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中古產品

儀器資料

一、Boron-doped diamond Electrodes(BDD含硼鑽石電極)

StandardElectrodes on silicon(標準矽基材電極)

BDD coating characteristics塗層特性

Available shapes, sizes and substrates(規格化形狀、尺寸、基材)

三、Custom Electrodes on silicon(客製化矽基材電極)

Different doping level and thicknesses,不同的添加濃度與厚度

Different shapes and sizes by using various specific cutting techniques.透過各種切割技術,提供不同的形狀和大小。

四、Standard Electrodes on metal(標準金屬基材電極)

BDD coating characteristicsBDD塗層特性

Film thickness膜厚 = 4-5μm,

Boron concentration含硼量 = 2500ppm,

BDD resistivity電阻率 = 15mΩ.cm.

Available shapes, sizes and substrates(規格化形狀、尺寸、基材):

五、Custom Electrodes on metal(客製化金屬基材電極)

Different doping level and thicknesses,不同的添加濃度與厚度

Different shapes and sizes.不同的形狀和大小。

Thickness

塗層厚度

Doping level

摻合量

Resistivity

電阻值

μm

ppm

at.cm-3

mΩ.cm

2-3

100

3.1019

500

2-3

700

2.1020

100

2-3

2500

8.1020

14

2-3

5000

2.1021

4

2-3

10000

3.1021

2

p-Silicon

矽晶圓種類

Thickness (mm)

基材厚度

Size (mm)

尺寸

Coated side

塗層面

Available doping level (ppm)

含硼摻合量等級

Monocrystalline

單晶

2

Rectangle長方形,

50 x 25

Monopolar (one)

單面

700

Monocrystalline

單晶

2

Rectangle長方形,

50 x 25

Bipolar (two)

雙面

700

Monocrystalline

單晶

2

Disc圓形, Φ100 mm

Monopolar (one)

單面

100, 700, 2500, 5000, 10000

Monocrystalline

單晶

2

Disc圓形, Φ100 mm

Bipolar (two)

雙面

700

Polycrystalline

多晶

1

Square方形,

100 x 100

Monopolar (one)

單面

100, 700, 2500, 5000, 10000

Polycrystalline

多晶

1

Square方形,

100 x 100

Bipolar (two)

雙面

700

Substrate基材

Mono- or polycristalline silicon (10-3 - 104 Ω.cm)單晶矽或多晶矽

Electrode Shape形狀

Disc, square, rectangular tailored shapes圓形、方形或矩形剪裁

External Size尺寸

Discs圓形 (3 to 200 mm), squares方形 (3x3 to 100x100 mm)

BDD Thickness塗層厚度

From less than 100 nm up to more than 25 μm

Boron concentration摻硼量

100-10’000 ppm

BDD resistivity (mΩ.cm)電阻值

2 - 10’000

Thickness uniformity (3σ)

厚度均勻度

±5% (within 100 mm)

Grain size塗層晶粒大小

40 nm at 100 nm film thickness

0.5 µm at 3µm film thickness

DCOI(絕緣體上的金剛石塗層)

(Diamond Coating On Insulator)

Diamond coating is also available on some insulating material such as Si3N4/SiO2

金剛石塗層也可用於某些絕緣材料,如Si 3 N 4 / SiO 2

Specific treatment特殊需求

Backside metallization Ti/Au available on request

可根據需求,提供背面特製金屬層Ti / Au

Substrates

基板

Thickness (mm)

基板厚度

Size (mm)

尺寸

Coated side

塗層面

Nb or Ta

1

Rectangle長方形, 50 x 25

Bipolar (two)

雙極雙面

Nb

1

Rectangle長方形, 50 x 100

Bipolar (two)

雙極雙面

Nb

1

Square方形, 100 x 100

Bipolar (two)

雙極雙面

Nb

1

Mesh平網狀, 50 x 100

Bipolar (two)

雙極雙面

Nb

1

Mesh平網狀, 100 x 100

Bipolar (two)

雙極雙面

Substrate基材

Niobium, Tantalum or Tungsten(鈮,鈦或鎢)

Electrode Shape

電極形狀

Disc, rectangle, rod, mesh, grid, custom(圓形、矩形、棒狀、網格、框、其他客製形狀)

External Size外部尺寸

Custom-specific up to 400x1200mm最大平面面積:400*1200MM

BDD Thickness厚度

from 1 μm to more than 20 μm

Boron concentration

含硼量

500-10’000 ppm

BDD resistivity (mΩ.cm)

電阻率

1 - 100

Thickness uniformity (3σ)厚度均勻度

±5% (within 100 mm)

Current density

目前密度

up to 500 mA/cm2

Operating conditions

使用條件

Anode陽極 / Cathode陰極 / Bipolar雙極

Resistance / Stability

抗性/穩定性

stable in harsh environment (strong acids, bases, alcohols, oils, complexing agents, aromatics, etc.),在惡劣環境下穩定(強酸,鹼,醇,油,絡合劑,芳烴等),

high temperatures, heterogeneous media, etc高溫,異種介質等